Semiconductors & AI Hardware: CEA-Leti demonstrated ferroelectric RAM scaled to a 22nm node using a 3D capacitor design, aiming to deliver non-volatile, denser, lower-power memory for edge AI. Chip Access Partnerships: The UK Semiconductor Centre and Rapidus signed an MoU to help UK firms access advanced chip manufacturing and prototyping, with Rapidus targeting 2nm processes for advanced computing and AI. AI Safety & Cybersecurity: South Korea’s MSIT signed an MOU with Anthropic to evaluate frontier AI safety and abuse risks, including red-teaming autonomous agents and focusing on Korean-language contexts. Energy Security Shockwaves: Oil slid after a US-Iran interim accord signaled easing of Strait of Hormuz disruptions, while Japan-linked supply-chain stress continues as naphtha prices raise bankruptcy fears. Space/Monitoring Tech: Norway’s NVE selected ICEYE for nationwide near real-time satellite flood monitoring using SAR analytics. Japan-India Tech & Industry: Japan PM Sanae Takaichi is set to visit Assam with executives from 50+ Japanese firms, targeting investment and cooperation in areas like semiconductors and supply chains. Cybersecurity Incident: FortiBleed reported leaked admin passwords tied to ~75,000 internet-facing Fortinet firewalls, highlighting ongoing brute-force risk. Materials for Lower Carbon Buildings: Pilkington (NSG) launched a float glass option with 35% lower embodied carbon using less virgin raw materials.